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發布時間:2017-12-20 10:12  
【廣告】



Bergquist GapFiller1500雙組分液態間隙填充導熱材料
材料生產商:美國貝格斯(BERGQUIST)公司研發產品
GapFiller1500可供規格:
規格(Specifications): 50CC、400CC、1200CC、10galon
導熱系數(Thermal Conductivity):1.8W/m-k
基材(Reinfrcement Carrier):硅膠
膠面(Glue):無
顏色(Color):黃色/白色
包裝(Pack):美國原裝進口包裝
持續使用溫度(Continous Use Temp):-60°~175°
密度(Density):2.7g/cc
GapFiller1500應用材料特性:
很好的剪切變稀特性(可以很大的提高點膠的速度和設備的可靠性),高抗流掛性,良好的型狀保持性能,很好貼服性,針對易碎和低壓力應用設計,100%固體-沒有固化副產品
GapFiller1500應用:
汽車電子,電腦和周邊,通訊,導熱防震,在任何產生熱量的半導體和散熱器之間
GapFiller1500技術優勢分析:
GapFiller1500導熱固體膠是雙分組包裝,在使用時需要使用相應的膠槍。膠槍根據導熱固體膠的容量大小而定。其比例為1:1 所以其A組與B組的容量對等。
Gap Filler 1500 is a two-part, high performance, thermally conductive liquid gap filling material, which features superior slump resistance and high shear thinningcharacteristics for optimized consistency and control during dispensing.The mixed system will cure at room temperature and can be accelerated with the addition of heat. Unlike cured thermal pad materials, a liquid approach offers infinite thickness variations with little or no stress to the sensitive components during assembly. Gap Filler 1500 exhibits low level natural tack characteristics and is intended for use in applications where a strong structural bond is not required. As cured, Gap Filler 1500 provides a soft, thermally conductive, form-inplace elastomer that is ideal for fragile assemblies and filling unique and intricate air voids and gaps.